A box of 100 Omniprobe® 3 post copper lift-out TEM grids which have been specifically designed for in-situ lift-out. These copper grids include multiple indexed mounting locations with both vertical bars and “V” shaped attachment surfaces and have a 3mm diameter.
Omniprobe® 3 post copper TEM lift-out grids which have been designed for in-situ lift-out. These grids have been designed for optimum access and include multiple indexed mounting locations with both vertical bars and “V” shaped attachment surfaces and have a shallower downset than other grids. 3mm diameter.
Omniprobe® 3 post copper lift-out TEM grids, 35 micron thick with 1 edge lower for easy access. These grids are similar to GRD-0001.08.01 with one lower side. They come packaged in glass vials.
Omniprobe® 3 post molybdenum lift-out grids specifically designed for in-situ lift-out. They include multiple indexed mounting locations, two with vertical bars attachment surfaces and two with “V” shaped alignment surfaces.
A box of 100 Omniprobe® 4 post copper TEM lift-out grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations, two with vertical bar attachment surfaces and two with "V" shaped alighment surfaces.
Box of 100 Omniprobe® 4 post copper TEM lift-out grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations, and have lower profile sides for easier access to outermost posts.
A box of 25 Omniprobe® 4-post lift-out grids for in-situ lift-out. These grids include multiple indexed mounting locations, two with vertical bars attachment surfaces and two with "V" shaped alignment surfaces. Made from Molybdenum.
5 post Omniprobe® copper lift-out TEM grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations, all with vertical bar attachment surfaces. They now come with lower profile sides for easier access to outermost posts.
A box of 100 Omniprobe® 5 post copper lift-out TEM grids specifically designed for in-situ lift-out. These CU grids include multiple indexed mounting locations, all with vertical bar attachment surfaces. Now with lower profile sides for easier access to outermost posts.
Omniprobe® Simple beryllium half ring grids, 3mm diameter. The metal is unaffected by air or water, even at red heat. Thickness (nominal) : 25 μm.
Box of 100 3 post copper Lift-out TEM grids for FIB applications.
Box of 100 5 post copper Lift-out TEM grids for FIB applications.
Box of 100 4 post copper Lift-out TEM grids for FIB applications.