FIB Lift-Out TEM Grids, 4 narrow posts, silicon - 100µm thickness. 100µm thickness meaning they are compatible with most standard TEM Grid holders. Post size is 80 x 100 x 190µm (W x D x H).
The thickness of the silicon lift-out grids is 100µm meaning they are compatible with most standard TEM holders. The half circular shape will slot nicely in the TEM grid holder.
These debris-free, metal-free lift-out grids will readily bond with Pt to attach the lamellas. The Straight edges are similar to the copper and molybedium grids which helps to make them easy to handle.
B-doped, conductive silicon minimizes charging during sample preparation and TEM imaging. These grids have four narrow posts, which can be shaped if needed. Post size is 80 x 100 x 190µm (W x D x H).
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