3 post copper lift-out grids specifically designed for in-situ lift-out.
These grids include multiple indexed mounting locations with both vertical bar and V shaped attachment surfaces.
These grids have a shallower downset and slightly wider center post than GRD-0001.01.01.
- Packaged in glass vials.
- Thickness (nominal) : 30 μm
- Post Downset (nominal) : 5 μm