5 post Omniprobe® copper lift-out grids specifically designed for in-situ lift-out. These TEM grids include multiple indexed mounting locations, all with vertical bar attachment surfaces and lower profile sides for easier access to outermost posts.
The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. The posts are designed for easy access and provide the user with a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a clear view of the thin sections attached to the posts.
Diameter : 3mm
Thickness (nominal) : 40 μm (25-30µm)
Post Downset (nominal) : 10 um
Unique Feature : 5th post is “E”
Technical Specifications:
| Posts | Material | Thickness (Nominal) Microns |
Nominal Post Downset Microns |
Unique Feature |
| 3 | Copper | 30 | 10 | — |
| 3 | Molybdenum | 30 | 10 | Top Downset Only |
| 0 | Berylium | 25 | N/A | Half Ring |
| 5 | Copper | 40 | 10 | 5th Post is "E" |
| 4 | Copper | 30 | 10 | — |
| 4 | Molybdenum | 30 | 10 | Top DS Only |
| 3 | Copper | 30 | 5 | Side Access |
| 3 | Copper | 30 | 5 | — |
| 5 | Copper | 35 | 5 | 5th Post is "E" |
| 4 | Copper | 30 | 5 | — |
PRODUCTS
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