3 post copper Omniprobe® lift-out grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations with both vertical bar and V shaped attachment surfaces. With a 3mm diameter, they come packaged in glassline envelopes. These Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems.
A key feature of these grids is that they have a sharp edge at the “downset”. This sharp edge gives easy access and helps show the user exactly where to place the lamella when mounting to the side of a post.
Diameter : 3mm
Thickness (nominal) : 30 μm (25-30µm)
Post Downset (Nominal) : 10 μm
| Posts | Material | Thickness (Nominal) Microns |
Nominal Post Downset Microns |
Unique Feature |
| 3 | Copper | 30 | 10 | — |
| 3 | Molybdenum | 30 | 10 | Top Downset Only |
| 0 | Berylium | 25 | N/A | Half Ring |
| 5 | Copper | 40 | 10 | 5th Post is "E" |
| 4 | Copper | 30 | 10 | — |
| 4 | Molybdenum | 30 | 10 | Top DS Only |
| 3 | Copper | 30 | 5 | Side Access |
| 3 | Copper | 30 | 5 | — |
| 5 | Copper | 35 | 5 | 5th Post is "E" |
| 4 | Copper | 30 | 5 | — |
PRODUCTS
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