4 post Omniprobe® copper lift-out grids specifically designed for in-situ lift-out. These grids include multiple indexed mounting locations, two with vertical bar attachment surfaces and two with V shaped alignment surfaces.
The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts. They come packaged in plastic vials.
Diameter : 3mm Thickness (nominal) : 30 μm
Post Downset (nominal) : 5 μm
| Posts | Material | Thickness (Nominal) Microns |
Nominal Post Downset Microns |
Unique Feature |
| 3 | Copper | 30 | 10 | — |
| 3 | Molybdenum | 30 | 10 | Top Downset Only |
| 0 | Berylium | 25 | N/A | Half Ring |
| 5 | Copper | 40 | 10 | 5th Post is "E" |
| 4 | Copper | 30 | 10 | — |
| 4 | Molybdenum | 30 | 10 | Top DS Only |
| 3 | Copper | 30 | 5 | Side Access |
| 3 | Copper | 30 | 5 | — |
| 5 | Copper | 35 | 5 | 5th Post is "E" |
| 4 | Copper | 30 | 5 | — |
PRODUCTS
TRAINING
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