3 Post Omniprobe® Copper Grids, side access (Box of 100)

GRD-0001.07.01
Omniprobe® 3 post copper lift-out TEM grids, 35 micron thick with 1 edge lower for easy access. These grids are similar to GRD-0001.08.01 with one lower side. They come packaged in glass vials.


$ 146.00

Quantity Discounts

Buy 5-9 items ($ 124.10 each)
Buy 10+ items ($ 109.50 each)
In Stock 60

Description

3 post copper lift-out grids, similar to GRD-0001.08.01, in design but 35 micron thick with 1 edge lower for easy access.

The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.


  • Thickness (nominal) : 35 μm
  • Post Downset (nominal) : 5 μm
  • Unique Feature : Side Access

Technical Specifications:

Posts Material Thickness (Nominal)
Microns
Nominal Post
Downset Microns
Unique Feature
3 Copper 30 10
3 Molybdenum 30 10 Top Downset Only
0 Berylium 25 N/A Half Ring
5 Copper 40 10 5th Post is "E"
4 Copper 30 10
4 Molybdenum 30 10 Top DS Only
3 Copper 30 5 Side Access
3 Copper 30 5
5 Copper 35 5 5th Post is "E"
4 Copper 30 5

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